Combining Soft Magnetic Materials with Advanced Pressing Technologies Supports 3D Magnetic Circuitry
Bud Jones, Vice President of New Technologies and Business Development, Symmco Inc.

Soft Magnetic Composites  (SMC) are iron powder particles encapsulated with an electrically insulated material supporting powder metallurgy compaction into complex shapes. Combining the 3D design with the isotropic material provides three-dimensional magnetic circuit design opportunities. Utilizing advanced pressing technologies designs can support smaller, lighter motors while meeting high efficiency requirements. These materials support net shape production reducing waste, and facilitating assembly enabling cost effective opportunity. Combining pressing process parameters with some of the newest equipment designed to support annealing SMC materials, this presentation will provide magnetic testing data to support design opportunity.  

Arthur (Bud) Jones has worked in the Powder Metal Part production industry at Symmco Inc for more than 35 years, starting in the production facility as a press set-up and operator for over 12 years.  While continuing production work Bud attended Penn State University at the DuBois campus attaining dual Associate Degrees, Materials Engineering and Mechanical Engineering.  Bud’s experience in Powder Metallurgy includes plant production, Quality Technician, Engineering Technician, Engineering Manager, and currently is the Vice President of New Technology and Business Development.  Bud’s involvement in the Powder Metal Industry includes the Standards Committee for the Metal Powder Industry Federation (MPIF) standard 35 for PM Structural Components and the MPIF Standard Test Methods for Powder Metallurgy Products.  Bud is currently President of the Center for Powder Metallurgy (CPMT) and is active on the ASTM committee for Powder Metallurgy.  

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